TSP #207 - Teardown & Detailed Analysis of Qualcomm's 60GHz Multi-Panel Phased Array WiGig System

In this episode Shahriar takes a close look at a wireless-Ethernet product based on Qualcomm's 60GHz WiGig chipset. The episode is inspired by the upcoming in-person RFIC & IMS IEEE conferences held starting June 19th, 2022 in Denver, Colorado, USA:

IEEE Radio Frequency Integrated Circuits Symposium: https://rfic-ieee.org/

IEEE International Microwave Symposium: https://ims-ieee.org/ims2022

The entire WiGig system architecture is analyzed end-to-end. The phased array module is presented using x-ray images and individual RFIC's are examined under microscope.

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